EMBEDDED CONSTRAINER DISCS FOR RELIABLE STACKED VIAS IN ELECTRONIC SUBSTRATES
摘要
A substrate via structure for stacked vias includes: a plurality of stacked vias, wherein each via is disposed on a landing; and at least one constrainer disc surrounding at least one via, for constraining in-plane deformation of the substrate via structure. The constrainer disc is embedded such that the constrainer disc is disposed between two layers of resin. The constrainer discs may be made of copper. The constrainer disc may be circular or square-shaped. Preferably there is a dielectric gap between the constrainer disc and the via.
申请公布号
EP2238620(A1)
申请公布日期
2010.10.13
申请号
EP20090731078
申请日期
2009.01.20
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
SRI-JAYANTHA, SRI;RUSSELL, DAVID, JOHN;KACKER, KARAN;QUESTAD, DAVID;POWELL, DOUGLAS, OLIVER