| 摘要 |
<p>A laser beam machine 1 includes retention mechanisms 2 for retaining a substrate 9 not to be moved with a processed surface up, processing nozzles 3 for traveling in the Y axis direction and emitting a laser beam to the processed surface of the substrate 9, the processing nozzles 3 being also movable in the X axis direction, a dust collection nozzle 5 for traveling in the Y axis direction following travel of the processing nozzles 3, and a support mechanism 4 relatively movable in the X axis direction relative to this substrate 9 while supporting the substrate 9 from the lower side. In the laser beam machine 1, the substrate 9 is not moved at the time of laser beam machining. While the processing nozzles 3 and the dust collection nozzle 5 travel, the laser beam machining is performed, and powder dust generated from a processed part to which the laser beam is irradiated is suctioned. At the time of pitch-feeding and moving the processing nozzles 3 in the X axis direction, the support mechanism 4 is also moved in the X axis direction, so that contact between the support mechanism 4 and a laser beam axis is avoided.</p> |
