| 发明名称 |
Method for welding with a multi-layer temperature profile |
| 摘要 |
<p>The method involves heating the solder material to a temperature of the temperature plateau (16') and retaining the solder material at heating temperature for a specific time period when starting the soldering operation. The temperature of solder material is lowered to the temperature of the temperature plateau (16''), from the temperature of the temperature plateau (16') and the component is soldered.</p> |
| 申请公布号 |
EP2239079(A1) |
申请公布日期 |
2010.10.13 |
| 申请号 |
EP20100006982 |
申请日期 |
2008.06.23 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BERGER, INGO;MUENZER, JAN;REINKENSMEIER, INGO;SETTEGAST, SILKE |
| 分类号 |
B23K1/00;B23K1/19;B23K101/00;B23P6/04;F01D5/00 |
主分类号 |
B23K1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
