<p>The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.</p>
申请公布号
EP2238816(A1)
申请公布日期
2010.10.13
申请号
EP20080869712
申请日期
2008.12.08
申请人
GE FANUC INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC.
