| 摘要 |
A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.
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