发明名称 |
CUTTING METHOD AND SEMICONDUCTOR CHIP |
摘要 |
It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target. |
申请公布号 |
KR20100110377(A) |
申请公布日期 |
2010.10.12 |
申请号 |
KR20107019033 |
申请日期 |
2004.07.16 |
申请人 |
HAMAMATSU PHOTONICS K.K. |
发明人 |
FUKUMITSU KENSHI |
分类号 |
B23K26/38;B23K26/03;B23K26/40;B28D1/22;B28D5/00;H01L21/301;H01S3/10 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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