发明名称 Method of manufacturing a semiconductor device having a stacked capacitor
摘要 A stacked capacitor in a memory cell has a bottom electrode made of a metal or metal compound, a capacitor insulation film and a top electrode made of a metal or a metal compound. The capacitor insulation film includes an aluminum oxide film having a thickness of 2 to 4 nm and in contact with the bottom electrode, and an overlying hafnium oxide film having a thickness of 3 to 6 nm. The stacked capacitor has a higher resistance against a biased temperature test.
申请公布号 US7811895(B2) 申请公布日期 2010.10.12
申请号 US20090464209 申请日期 2009.05.12
申请人 ELPIDA MEMORY, INC. 发明人 IIJIMA SHINPEI
分类号 H01L21/20 主分类号 H01L21/20
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