| 摘要 |
<p>A sheet sticking apparatus 10 includes a first case 20 for accommodating a table 11 for supporting a semiconductor wafer W, a second case 21 for forming a decompression chamber C with the first case 20, and feeding means 15 for feeding an adhesive sheet S to a position where the adhesive sheet S faces the semiconductor wafer W. The second case 21 includes a bulkhead 30 for forming a pressure adjusting chamber C1 in a state where a single decompression chamber C is formed, the pressure adjusting chamber C1 being capable of controlling the pressure therein independently of the decompression chamber C, wherein the adhesive sheet S is stuck to the semiconductor wafer W under decompression by setting the decompression chamber C in a decompression state and relatively increasing the pressure in the pressure adjusting chamber C1.</p> |
