| 摘要 |
PURPOSE: A method for forming a substrate structure and a method for manufacturing a device including the same are provided to improve the electrical characteristic and the mechanical characteristic by filling insulating materials, semiconductor materials, or metal in a concave part. CONSTITUTION: A first material layer is formed on a substrate(1) including a concave part(2). The material layer on a part around the concave part is eliminated using a second material which reacts with a first material. A deposition film(40) is formed from the first material layer using a third material which reacts with the first material. The first material is raw material precursor, and the third material is reaction precursor.
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