| 摘要 |
PURPOSE: A lead frame for the mounting of the chip which has the effective heat radiation structure for the large area light source lamp, and an electric component and a manufacturing method thereof are provided to improve the light diffusion about the light emitted from the LED chip. CONSTITUTION: PCB forms at least one penetration hole(21) and at least two electrode lead. A chip(90) is set up on the metal plate of the penetration hole area. A transparent resin(80) molds the surrounding of a chip with the predetermined fluorescence agent. At least one penetration hole for the chip mounting and at least two electrode leads(12) are formed on the front side of PCB. A metal coating layer(51/52) is formed on a metal layer(14) formed on an electrode lead(12) and a lead frame. |
