发明名称 NEGATIVE-TYPE PHOTORESIST COMPOSITION, METHOD OF FORMING A PATTERN AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE PHOTORESIST COMPOSITION
摘要 PURPOSE: A formation method of a pattern, and a negative photoresist composition are provided to improve the etch-resistance, the line width roughness, and the pattern profile by curing a polymer without a heating process. CONSTITUTION: A formation method of a pattern comprises the following steps: spreading a polymer insoluble for a developer by being cross-linked with acid, including an alkoxy silyl group, and a negative photoresist composition including a photo acid generator and a solvent, to form a photoresist film on a substrate; irradiating lights to a first portion of the photoresist film, to cure the polymer in the first portion by the cross-linking of the alkoxy silyl group; and removing a second portion by applying the developer to the photoresist film, and forming the photoresist pattern.
申请公布号 KR20100109111(A) 申请公布日期 2010.10.08
申请号 KR20090027541 申请日期 2009.03.31
申请人 SAMSUNG ELECTRONICS CO., LTD.;KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 KIM, KYOUNG MI;KIM, JIN BAEK;PARK, JI YOUNG;KIM, YOUNG HO
分类号 G03F7/039;G03F7/004;G03F7/075 主分类号 G03F7/039
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