发明名称 THERMOSETTING RESIN COMPOSITE HAVING IMPROVED THERMAL EXPANSION
摘要 PURPOSE: A thermosetting resin composite is provided to secure the low thermal expansion coefficient, and to improve the dimensional stability and workability by the increase of the temperature. CONSTITUTION: A thermosetting resin composite contains an epoxy resin and an amine curing agent having a naphthalene core. The amine curing agent having the naphthalene core is selected from the group consisting of compound marked with chemical formula 1~5. In the chemical formula 2, R1 is a C1~C10 alkanediyl group. In the chemical formula 3, R2 is a single bond or C1~C5 alkanediyl group. In the chemical formula 4, R1 is the C1~C10 alkanediyl group.
申请公布号 KR20100108845(A) 申请公布日期 2010.10.08
申请号 KR20090027101 申请日期 2009.03.30
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 CHUN, HYUN AEE;SHIN, SEUNG HAN;KIM, HYUN AH;CHANG, SUK KU;OH, CHANG HO;KIM, YUN JU
分类号 C08L63/00;C08K3/22;C08K5/17;C08K5/18 主分类号 C08L63/00
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