发明名称 |
THERMOSETTING RESIN COMPOSITE HAVING IMPROVED THERMAL EXPANSION |
摘要 |
PURPOSE: A thermosetting resin composite is provided to secure the low thermal expansion coefficient, and to improve the dimensional stability and workability by the increase of the temperature. CONSTITUTION: A thermosetting resin composite contains an epoxy resin and an amine curing agent having a naphthalene core. The amine curing agent having the naphthalene core is selected from the group consisting of compound marked with chemical formula 1~5. In the chemical formula 2, R1 is a C1~C10 alkanediyl group. In the chemical formula 3, R2 is a single bond or C1~C5 alkanediyl group. In the chemical formula 4, R1 is the C1~C10 alkanediyl group.
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申请公布号 |
KR20100108845(A) |
申请公布日期 |
2010.10.08 |
申请号 |
KR20090027101 |
申请日期 |
2009.03.30 |
申请人 |
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY |
发明人 |
CHUN, HYUN AEE;SHIN, SEUNG HAN;KIM, HYUN AH;CHANG, SUK KU;OH, CHANG HO;KIM, YUN JU |
分类号 |
C08L63/00;C08K3/22;C08K5/17;C08K5/18 |
主分类号 |
C08L63/00 |
代理机构 |
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地址 |
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