| 摘要 |
PURPOSE: A chip type heat-sink is provided to reduce the surface mounting area of a PCB and to improve a heat dissipation and distribution effect. CONSTITUTION: A chip type heat-sink(10) has a three dimensional volume shape and a body made of a metal material, which has a horizontal plane on the surface. The heat-sink is mounted on the conductive pattern of a PCB by being picked up through a vacuum pick-up process. A rear side is adhered to the conductive pattern with a reflow soldering process. |
