SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method of manufacturing the same are provided to improve the reliability of a semiconductor package by forming a nickel pump on a bonding pad of the semiconductor chip. CONSTITUTION: A semiconductor package comprises a semiconductor chip(10) and a nickel bump(20). The semiconductor chip has a circuit unit and a bonding pad(5). The nickel bump is formed on the bonding pad. The nickel bump has a cone or a truncated cone shape. The nickel bump comprises Ni powder of about 50-80wt% and a binder of 20-50wt%. The binder comprises an epoxy resin.