PURPOSE: A dual curing composition is provided to prevent the under-curing problem by radiating the activation energy including ultraviolet rays and electronic beams, and to secure the low viscosity and the high solid content. CONSTITUTION: A dual curing composition contains the following: a polyorthoester compound obtained by exchange reacting an alkoxy group of orthoester with a hydroxyl group compound and a glycol compound; a polymerizable unsaturated compound including a polymerizable unsaturated group and a group can be reacted with a hydroxyl group; and a photopolymerization initiator.
申请公布号
KR20100109030(A)
申请公布日期
2010.10.08
申请号
KR20090027406
申请日期
2009.03.31
申请人
JIN DO HWA SUNG CO., LTD.
发明人
JO, HEON YOUNG;EL SAYED MOUSSA NEGIM;CHOI, WON KEUN;CHOI, JUNG KYU