发明名称 DUAL CURING COMPOSITIONS
摘要 PURPOSE: A dual curing composition is provided to prevent the under-curing problem by radiating the activation energy including ultraviolet rays and electronic beams, and to secure the low viscosity and the high solid content. CONSTITUTION: A dual curing composition contains the following: a polyorthoester compound obtained by exchange reacting an alkoxy group of orthoester with a hydroxyl group compound and a glycol compound; a polymerizable unsaturated compound including a polymerizable unsaturated group and a group can be reacted with a hydroxyl group; and a photopolymerization initiator.
申请公布号 KR20100109030(A) 申请公布日期 2010.10.08
申请号 KR20090027406 申请日期 2009.03.31
申请人 JIN DO HWA SUNG CO., LTD. 发明人 JO, HEON YOUNG;EL SAYED MOUSSA NEGIM;CHOI, WON KEUN;CHOI, JUNG KYU
分类号 C08G63/46;C08G63/58;C08G63/60;C08L67/04 主分类号 C08G63/46
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