THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF

摘要

PURPOSE: A thermosetting resin composition and a cured product thereof are provided to reduce the linear expansion coefficient by connecting a linear thermosetting resin to a through-hole of an amorphous silica corpuscle. CONSTITUTION: A thermosetting resin composition contains a linear thermosetting resin, and an amorphous silica corpuscle with a hole unit. The linear thermosetting resin selected form the group consisting of a linear epoxy resin, and a linear episulfide resin. The amorphous silica corpuscle has a honeycomb structure and the pore diameter of 1~10 nanometers.