发明名称 SIDE-VIEW LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A lateral light emitting diode package is provided to uniformize the thickness of fluorescent materials laminated on the bottom of a cavity by forming a vertical step in an inclined bottom of the cavity. CONSTITUTION: A cavity is formed on the front side of a body(210). An incline(211a) is formed on the inner wall of the cavity. A vertical step(211b) is formed on the bottom of the incline. A first lead frame and a second lead frame are extended to the outside of the body of the package. An LED chip(201) is mounted on the first lead frame or second lead frame.
申请公布号 KR20100108977(A) 申请公布日期 2010.10.08
申请号 KR20090027322 申请日期 2009.03.31
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM, GUN HEE;LEE, MYUNG HEE
分类号 H01L33/48;H01L33/50;H01L33/60 主分类号 H01L33/48
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