发明名称 |
SIDE-VIEW LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A lateral light emitting diode package is provided to uniformize the thickness of fluorescent materials laminated on the bottom of a cavity by forming a vertical step in an inclined bottom of the cavity. CONSTITUTION: A cavity is formed on the front side of a body(210). An incline(211a) is formed on the inner wall of the cavity. A vertical step(211b) is formed on the bottom of the incline. A first lead frame and a second lead frame are extended to the outside of the body of the package. An LED chip(201) is mounted on the first lead frame or second lead frame.
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申请公布号 |
KR20100108977(A) |
申请公布日期 |
2010.10.08 |
申请号 |
KR20090027322 |
申请日期 |
2009.03.31 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KIM, GUN HEE;LEE, MYUNG HEE |
分类号 |
H01L33/48;H01L33/50;H01L33/60 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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