LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to reflect light from a lead frame to the outside of a light emitting diode package by forming a reflection unit made of materials with high reflectivity on a lens unit. CONSTITUTION: A light emitting module comprises a lead frame(210), a light emitting diode(220) and a housing(240). The light emitting chip is electrically connected to a lead frame and emits light. The lead frame includes a first lead terminal(210a) and a second lead terminal(210b) which are electrically separated. The housing has a groove to expose the light emitting chip. The lens unit includes a lens body and a reflector(320). The reflector is made of materials with high reflectivity.