| 摘要 |
PURPOSE: A molding process is provided to increase the productivity of an LED chip radiating the same wavelength by evenly molding a fluorescent substance on a plurality of LED chips. CONSTITUTION: In a molding method, an LED chip is mounted in a printed circuit board(S100). Fluorescent substance, silicon, and silicon dioxide are mixed to form a sealing material(S200). The sealing material is mold to the substrate having the LED chip mounted therein(S300).
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