发明名称 A ROTARY-TYPE PLATING APPARATUS AND PLATING SYSTEM HAVING THE SAME
摘要 PURPOSE: A rotary plating device is provided to reduce plating costs and to increase productivity by partially plating a plating target by selectively emitting plating liquid to the appointed area of a plating target. CONSTITUTION: A rotary plating device comprises a rotary drum(10), a jet block, a plating liquid feeding unit, support unit(40) and a guide unit(50). The rotary drum is located to be contacted with a carrier and rotates along with the carrier. The jet block is rotated with the rotary drum. The jet block emits plating liquid to the appointed area of the plating target of the carrier. The plating liquid feeding unit supplies plating liquid to the jet block to in a radial direction.
申请公布号 KR20100109170(A) 申请公布日期 2010.10.08
申请号 KR20090027632 申请日期 2009.03.31
申请人 SFHITEC CO., LTD. 发明人 HONG, GEE
分类号 C25D17/20 主分类号 C25D17/20
代理机构 代理人
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