| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for back grinding having excellent dimension stability that hardly causes warpage on a thin semiconductor wafer in a back grinding process of the thin semiconductor wafer, and to provide a back grinding film including the substrate film for back grinding. SOLUTION: The substrate film for back grinding includes at least three layers including front and rear layers and an intermediate layer. In the substrate film, the front and rear layers are made of a resin composition containing 95-5 wt.% soft polyester resin and 5-95 wt.% polyester-based elastomer, and the intermediate layer is made of a resin composition containing 100-50 wt.% soft polyester resin and 0-50 wt.% polyester-based elastomer. COPYRIGHT: (C)2011,JPO&INPIT
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