| 摘要 |
Camera modules are provided using wafer level optics structures. Wafers of optical stack components such as spacers, lenses, filters, and aperture layers may be combined to form optical stacks for camera modules. Each optical stack may be formed from pieces of the lens and spacer wafers. The optical stacks may be mounted above digital image sensors to form compact camera modules for devices such as cellular telephones and digital cameras. To reduce lens flare, a lens hood structure may be mounted above the outermost lens in the optical stack structure. The lens hood structure may be formed from a layer of opaque plastic having an inner surface and an outer surface. The layer of plastic may be provided as part of a camera module housing or as a separate structure. A noncircular lens hood aperture may be formed in the outer surface of the lens hood layer. A corresponding inner aperture may be formed in the inner surface of the lens hood layer adjacent to the optical stack structure. The noncircular exterior surface aperture of the lens hood may have a barrel shape, a rectangular shape, an oval shape, a pincushion shape, or other suitable shapes that help reduce flare for digital image sensors with rectangular active areas.
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