发明名称 |
Cooling System for Electronic Components |
摘要 |
Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
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申请公布号 |
US2010254089(A1) |
申请公布日期 |
2010.10.07 |
申请号 |
US20090417921 |
申请日期 |
2009.04.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDERL WILLIAM JAMES;COLGAN EVAN GEORGE;GERKEN JAMES DORANCE;MARROQUIN CHRISTOPHER MICHAEL;TIAN SHURONG |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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