| 摘要 |
A thermal energy dissipating and LED mounting arrangement includes an LED and a thermally conductive sheet. The thermally conductive sheet has a top surface, a bottom surface and thickness therebetween defining an opening therethrough sized to receive therein the LED such that the thickness of the thermally energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED. The thickness defining the opening absorbs thermal energy generated within the LED as a result of current flow through the LED circuit, and the thermal energy dissipating medium rejects the absorbed thermal energy to an ambient environment surrounding the thermal energy dissipating medium through a surface area of the thermal energy dissipating medium defined by the combination of the top surface, the bottom surface and an outer periphery thereof. |
