发明名称 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME
摘要 <p>A semiconductor device having a planarization layer that is comprised by an inorganic film and formed with recesses at regions where a conductive film is disposed. A first contact hole running through at least an interlayer insulating film is formed on a first interconnect layer, while a second contact hole running through at least the interlayer insulating film is formed on the conductive film in a manner which has the second contact hole passing through the inward side of a recess.</p>
申请公布号 WO2010113229(A1) 申请公布日期 2010.10.07
申请号 WO2009JP06368 申请日期 2009.11.25
申请人 SHARP KABUSHIKI KAISHA;NAKAZAWA, MAKOTO;MIYAMOTO, MITSUNOBU 发明人 NAKAZAWA, MAKOTO;MIYAMOTO, MITSUNOBU
分类号 H01L21/768;G09F9/30;H01L21/28;H01L21/336;H01L29/417;H01L29/786 主分类号 H01L21/768
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