LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting diode (LED) package structure improved in light emitting uniformity.

SOLUTION: A carrier 110 and at least one LED chip 120 having a light emitting surface 122 and a plurality of side surfaces 124 are provided. A first mask M1 having at least one first opening is provided, and the first opening exposes at least the LED chip. A spray coating apparatus 200 is provided above the first mask to perform a first spray coating process. The spray coating apparatus moves back and forth to spray a first phosphor solution 130' over the LED chip so that the light emitting surface and the side surfaces of the LED chip are conformally coated by the sprayed first phosphor solution. The first phosphor solution is cured to form a first fluorescent layer 130 by performing a curing process. A molding compound is formed to encapsulate the first fluorescent layer and a portion of the carrier.

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