| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet in which a semiconductor chip is laminated onto a substrate or the other electronic component so as to bond them and a crack is difficult to occur in the semiconductor chip when the semiconductor chip is covered with a resin mold layer. <P>SOLUTION: The adhesive sheet is used for bonding a semiconductor chip 8 onto the substrate 2 through an adhesive sheet 3 after hardening or bonding semiconductor chips 9 to 12 onto the other semiconductor chips 8 to 11 through adhesive sheets 4 to 7 after hardening. The adhesive sheet includes hardening resin and elastic particles. The size following a thickness direction of the adhesive sheets 3 to 7 after hardening the elastic particles 3a to 7a is equal to the thickness of the adhesive sheets 3 to 7 after hardening. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
