| 发明名称 |
AQUEOUS DISPERSING ELEMENT FOR CHEMICAL MECHANICAL POLISHING |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing that suppresses erosion and its speed when overpolishing is carried out in a chemical mechanical polishing process. <P>SOLUTION: The aqueous dispersing element for chemical mechanical polishing includes: an abrasive grain; water; and potassium dodecylbenzene sulfonate and/or ammonium dodecylbenzene sulfonate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2010226141(A) |
申请公布日期 |
2010.10.07 |
| 申请号 |
JP20100141287 |
申请日期 |
2010.06.22 |
| 申请人 |
JSR CORP |
发明人 |
NISHIMOTO KAZUO;YAMAGUCHI TOMOYUKI;HATTORI MASAYUKI;KAWAHASHI NOBUO |
| 分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
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