发明名称 ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF AN ELECTRONIC DEVICE
摘要 An electronic component mounting structure includes: a casing provided with an accommodating portion, an insertion opening formed at outside of the accommodating portion, and a threaded hole to which a screw is fastened; an electronic component including a contact terminal having elasticity; a printed circuit board having a conductor layer electrically connectable to the contact terminal; and a fixing plate provided with a fitting portion configured to fit into the insertion opening, and a screw insertion hole through which the screw is inserted, and configured to fix the printed circuit board. In the accommodating portion, the fixing plate is disposed on the printed circuit board, and the printed circuit board is disposed on the electronic component. The fixing plate is fixed to the casing by the screw inserted through the screw insertion hole in a state where the fitting portion is fitted into the insertion opening.
申请公布号 US2010254101(A1) 申请公布日期 2010.10.07
申请号 US20090556772 申请日期 2009.09.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IHARA AKIO;NAKAMURA YUTAKA;TOKUNAGA HIROHISA;IMAMIYA KUNIAKI
分类号 H05K5/00;H05K13/00 主分类号 H05K5/00
代理机构 代理人
主权项
地址