发明名称 CIRCUIT BOARD FOR MULTI-TYPE HEAT DISSIPATING DEVICES
摘要 The invention discloses a circuit board. The circuit board includes a body having an electric component holding portion according to the invention. A plurality of groups of fixing holes for fixing various types of heat dissipating devices are formed on the body adjacent to the electric component holding portion. With such a systematized layout, as a result, the number of fixing holes arranged is increased to improve the compatibility of circuit board for various heat dissipating devices, in spite of a limited space allowed on the circuit board.
申请公布号 US2010252302(A1) 申请公布日期 2010.10.07
申请号 US20100752756 申请日期 2010.04.01
申请人 ASUSTEK COMPUTER INC. 发明人 TSAO KUO WEI;CHEN JIAN TZUO;CHEN YUEH CHIH
分类号 H05K1/00 主分类号 H05K1/00
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