| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film which does not decrease luminous efficiency when used for flip chip mounting of a light-emitting device using a light-emitting diode element, since the anisotropic conductive film eliminates the necessity for providing the LED element with a light-reflecting layer, which leads to an increase in production costs, and to provide a light-emitting device using the anisotropic conductive film. <P>SOLUTION: The anisotropic conductive film is obtained by laminating a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer, and the light-reflecting insulating adhesive layer has a structure wherein light-reflecting particles are dispersed in an insulating adhesive. The light-emitting device has a structure wherein the light-emitting diode element is flip chip mounted on a substrate, with the anisotropic conductive film being arranged between a connection terminal on the substrate and a connection bump of the light-emitting diode element. <P>COPYRIGHT: (C)2011,JPO&INPIT |
