发明名称 METHOD OF FORMING SURFACE PROTECTIVE FILM OF SURFACE-MOUNTED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a surface protective film, which occupies a small space, has few production man-hours and excellent mass productivity, the method sticking powder coating to all except for a terminal surface for mounting by forming the surface protective film by the powder coating on a plurality of surface-mounted electronic components and therefore dispensing with a cutting process. SOLUTION: When forming the surface protective film by the powder coating on the surface-mounted electronic components, by arranging the plurality of surface-mounted electronic components while the terminal surfaces for mounting of the surface-mounted electronic components is abutted on a support member, the powder coating is stuck to all except for the terminal surface for mounting of the surface-mounted electronic components by a coating apparatus, and the powder coating stuck to the surface-mounted electronic component is fixed by heating. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010221174(A) 申请公布日期 2010.10.07
申请号 JP20090073275 申请日期 2009.03.25
申请人 CITIZEN FINETECH MIYOTA CO LTD;CITIZEN HOLDINGS CO LTD 发明人 TAKIZAWA SATOSHI
分类号 B05D7/00;B05D7/24;H03H3/02;H03H3/08;H03H9/02;H03H9/25 主分类号 B05D7/00
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