STEP-DOWN TRANSITION OF A SOLDER HEAD IN THE INJECTION MOLDING SOLDERING PROCESS

摘要

A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.