METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

摘要

A method for cleaning a semiconductor substrate (1010) using an ultra/mega sonic device (1003) is provided. The method comprises holding a semiconductor substrate (1010) by using a chuck (1014); positioning an ultra/mega sonic device (1003) adjacent to the semiconductor substrate (1010); injecting chemical liquid (1032) on the semiconductor substrate (1010) and into a gap between the semiconductor substrate (1010) and the ultra/mega sonic device (1003) by using at least one nozzle (1012); and changing the gap between the semiconductor substrate (1010) and the ultra/mega sonic device (1003) for each rotation of the chuck (1014) during the cleaning process by turning the semiconductor substrate (1010) or the ultra/mega sonic device (1003) clockwise or count clockwise. An apparatus for cleaning a semiconductor substrate (1010) using an ultra/mega sonic device (1003) is also provided.