发明名称 MULTIFREQUENCY CAPACITIVELY COUPLED PLASMA ETCH CHAMBER
摘要 A plasma processing system for use with a gas. The plasma processing system comprises a first electrode, a second electrode, a gas input port, a power source and a passive circuit. The gas input port is operable to provide the gas between the first electrode and the second electrode. The power source is operable to ignite plasma from the gas between the first electrode and the second electrode. The passive circuit is coupled to the second electrode and is configured to adjust one or more of an impedance, a voltage potential, and a DC bias potential of the second electrode. The passive radio frequency circuit comprises a capacitor arranged in parallel with an inductor.
申请公布号 US2010252199(A1) 申请公布日期 2010.10.07
申请号 US20090533984 申请日期 2009.07.31
申请人 发明人 MARAKHTANOV ALEXEI;DHINDSA RAJINDER;KOSHIISHI AKIRA;FISCHER ANDREAS
分类号 H01L21/306;C23C16/513 主分类号 H01L21/306
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