| 摘要 |
PURPOSE: A multilayer package and a transmission/reception module package of a phase array radar using the same are provided to improve signal interference and reception sensitivity by mounting a transmission module and a reception module on different package substrates. CONSTITUTION: A printed circuit board(100) includes a plurality of circuit wiring patterns, a plurality of conductive pads, and at least one recess. A plurality of package substrates(102-104) are arranged in a recess of the printed circuit board and are electrically connected to the circuit wiring patterns. The plurality of package substrates are electrically connected through a conductive via. At least one circuit component is mounted on each package substrate. A heat sink(105) is connected to the lowermost package substrate among the plurality of package substrates. |
