发明名称 CASE MOLD TYPE CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case mold type capacitor which has stable insulating performance. SOLUTION: The case mold type capacitor includes a capacitor element 5 formed by laminating or winding a metallized film formed by vapor-depositing metal on a dielectric film, a plurality of bus bars having the capacitor element 5 connected to one-end sides, flat plate type external connection terminal portions 1b and 2b provided at the other sides of the bus bars, a case 6 which contains the capacitor element 5 and has an opening on an upper surface, and a filling resin which fills the case 6 to cover the bus bars and capacitor element 5 except parts of the external connection terminal portions 1b and 2b. The external connection terminal portions 1b and 2b have mutually overlapping overlap portions 7, which are wound with an insulating sheet 3 to be covered while insulated, and a gap 3a is provided between the insulating sheet 3 and a side surface portion 1d of the external connection terminal portion 1b, and the filling resin is charged in the gap 3a. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010225970(A) 申请公布日期 2010.10.07
申请号 JP20090073315 申请日期 2009.03.25
申请人 PANASONIC CORP 发明人 TOMITA MAKOTO;HOSOKAWA SATOSHI
分类号 H01G4/18 主分类号 H01G4/18
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