| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure having high reliability in electric connection, and to provide a method of manufacturing the same. SOLUTION: The method of manufacturing the wiring structure 50 includes steps of: forming an uncured first heat-curable resin layer 42 on the bottom surface of a substrate 40 of a COF (Chip On Film) 13 so as to cover a plurality of conductors 41; forming an uncured second heat-curable resin layer 43 in each position corresponding to an electrode land 41a on the top surface of the substrate 40 of the COF 13; and curing the first and second heat-curable resin layers 41 and 43 by heating the COF 13 in a state where the COF 13 is pressurized toward a piezoelectric actuator 12, so that each bump 39 may pass through the first heat-curable resin layer 42 and come in contact with the electrode land 41a, and also, the first heat-curable resin layer 42 may come in contact with the surface of the piezoelectric actuator 12 so as to surround the bump 39. COPYRIGHT: (C)2011,JPO&INPIT
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