发明名称 |
POLISHING APPARATUS AND POLISHING METHOD |
摘要 |
A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.
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申请公布号 |
US2010255756(A1) |
申请公布日期 |
2010.10.07 |
申请号 |
US20100730409 |
申请日期 |
2010.03.24 |
申请人 |
ISHII YU;SHIOKAWA YOICHI;HEIANNA JYOJI;MATSUO HISANORI |
发明人 |
ISHII YU;SHIOKAWA YOICHI;HEIANNA JYOJI;MATSUO HISANORI |
分类号 |
B24B1/00;B24B37/04;B24B49/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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