ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF

摘要

An electronic package is provided, which comprises at least a first module (2) and a second module (4) arranged on top of the first module (2), wherein the first and second modules (2, 4) are adhesively connected together and in the form of a module stack. Each of the modules (2,4) includes a substrate layer (8) with at least one metal layer (10), at least one die (16, 22) and a plastic package molding compound layer (32) molded over the die or dice (16, 22), wherein the die or dice (16, 22) are bonded on the substrate layer (8) via the metal layer (10), and a plurality of channels (34, 36, 38, 40, 42, 44) are formed generally vertically acting as vias to connect the metal layers (10) in different modules. Some or all the channels (34, 36, 38, 40, 42, 44) are provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection, whereby the dice (16, 22) in the module stack are electrically connected together. At least one module (2) includes a means (46) which is connected to the channels (34, 36, 38, 40, 42, 44) and serves as an intermediary for providing electrical, mechanical and thermal connectivity, and communication externally. A method for fabricating the electronic package is also provided.