发明名称 |
METHOD OF MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing group III nitride semiconductor substrate capable of obtaining a group III nitride semiconductor substrate without requiring time and efforts. <P>SOLUTION: The method of manufacturing group III nitride semiconductor substrate comprises: a process of forming a carbon film as a first film 11 on a base substrate 10; a process of forming a titanium carbide layer 12 on the first film 11; a process of nitriding the titanium carbide layer 12; a process of epitaxially growing a GaN semiconductor layer on the upper part of the nitrided titanium carbide layer; and a process of removing the base substrate 10 from the GaN semiconductor layer to obtain a GaN semiconductor substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010222642(A) |
申请公布日期 |
2010.10.07 |
申请号 |
JP20090071618 |
申请日期 |
2009.03.24 |
申请人 |
FURUKAWA CO LTD |
发明人 |
WASHIMI NORIHIKO;SUNAKAWA HARUO;YAMAMOTO KAZUTOMI |
分类号 |
C23C14/34;C23C14/06;C23C14/58;C23C16/01;C23C16/26;C23C16/32;C23C16/34;C23C16/56;C30B29/38;C30B29/40;H01L33/32;H01S5/323 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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