发明名称 DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a device manufacturing method for forming an alignment mark which attains precise detection without affecting device performance. <P>SOLUTION: The device manufacturing method at least includes a process for forming a lamination film where a first film on the side of an upper layer is constituted of a material having resistance against etching with respect to a second film on the side of a lower layer, a process for patterning the first film in an element forming region and an alignment mark forming region, a process for protecting at least a region excluding a part close to the patterned first film in the alignment mark forming region with the use of a material having resistance against etching with respect to the second film, and an etching process for selectively etching the second film with the patterned first film as a mask. The step of the alignment mark constituted of the first film is increased by digging the circumference of the patterned first film. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010225647(A) 申请公布日期 2010.10.07
申请号 JP20090068389 申请日期 2009.03.19
申请人 NEC CORP 发明人 TOYAMA SHIGERU
分类号 H01L21/027;H01L37/00 主分类号 H01L21/027
代理机构 代理人
主权项
地址