| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer that effectively suppresses junction stress generated when electronic members having greatly different thermal expansion coefficients are bonded to each other, when a ceramic package is mounted on a printed circuit board, for example. SOLUTION: The interposer has several through-holes which are formed in a conductive flat substrate 2 having a low thermal expansion coefficient such as a laminated CFRP plate or the like with predetermined pitches so that their opening diameters may be different between the upper side and the lower side. It also has conductive vias 5 in the through-holes which are insulated from the substrate. Electrodes 6 are formed on the upper side and lower side which are connected with the vias. Electronic members are mounted on each of the electrodes on the top side and the underside. Further, the opening diameters of the top side and the underside are changed in accordance with the thermal expansion coefficients of the electronic members to be connected to the top side and the underside by using an effect that the larger an opening diameter formed in the flat substrate, the higher the effective thermal expansion coefficient on that side. COPYRIGHT: (C)2011,JPO&INPIT |
