| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder powder capable of suppressing rise in viscosity of a solder paste when storing the solder paste, suppressing deterioration in meltability of the solder paste after storing the polder paste, and further suppressing rise in viscosity of the solder paste during the treatment in printing using a printer, by suppressing reaction of a surfactant in a solder flux and a solder powder, and to provide a solder paste using the same powder. SOLUTION: The surface of a solder powder that contains Sn as a main constituent is subjected to surface treatment using the following compounds: a compound having both of a thiol group and a carboxyl group in its structure; a triazine compound that is expressed by a constitutional formula (1); a sulfide compound that is expressed by a constitutional formula (2), ( R<SP>4</SP>or R<SP>5</SP>is an organic group) or a disulfide compound that is expressed by a constitutional formula (3), ( R<SP>6</SP>or R<SP>7</SP>is an organic group). In formula (1), R<SP>1</SP>is a thiol group, an amino group substituted by an alkyl group, or an amino group or an anilino group substituted by an allyl group; and R<SP>2</SP>or R<SP>3</SP>is a thiol group or -SM (M represents an alkali metal). COPYRIGHT: (C)2011,JPO&INPIT
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