| 摘要 |
A semiconductor device of the present invention includes a semiconductor chip formed with an electrode pad on a front side thereof, a wiring board having a wiring pattern, the wiring board having a front side opposing the back side of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the back side of the wiring board for electrical connection with the electrode pad through the wire and the wiring pattern, and a sealant for fixing the semiconductor chip on the front side of the wiring board so as to form a hollow which is continuous to a portion straddling the entirety of the back side of the semiconductor chip and the front side of the wiring board, and continuous to a portion adjacent to at least one outer peripheral surface of the semiconductor chip except for the back side of the same. The wiring board includes a throughhole in communication with the hollow.
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