发明名称 HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT MANUFACTURING METHOD
摘要 A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.
申请公布号 US2010252237(A1) 申请公布日期 2010.10.07
申请号 US20100729713 申请日期 2010.03.23
申请人 SONY CORPORATION 发明人 HASHIMOTO MITSUO;YAZAWA KAZUAKI;KASAI HIROTO;ISHIDA YUICHI;RYOSON HIROYUKI
分类号 F28D15/00 主分类号 F28D15/00
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