WIRE-BONDED SEMICONDUCTOR PACKAGE WITH A COATED WIRE

摘要

The invention concerns a semiconductor package comprising a semiconductor die (3) attached to a support (2) having electrically conductive paths, (6) said semiconductor die having a bond-pad (4) electrically connected to an electrically conductive path (6) on said support by a wire-bond (7) of a first metallic composition, such as an alloy of copper, said wire-bond and said bond-pad being coated with a protection layer (40) of a second metallic composition, such as an alloy of nickel.