发明名称 |
INSPECTION CONDITION DATA GENERATION METHOD AND INSPECTION SYSTEM OF SEMICONDUCTOR WAFER APPEARANCE INSPECTION APPARATUS |
摘要 |
<p>A wafer inspection condition generation method for generating inspection condition data for a plurality of inspection apparatuses which inspect the appearance of semiconductor chips formed on wafers (10). The method is provided with the following steps: a step of calculating the individual difference, for each wafer inspection apparatus (A to C), from a design value, then registering individual difference correction data; a step of generating inspection condition data using a wafer (10), at any selected wafer inspection apparatus (A); a step of generating common inspection condition data from the inspection condition data and the individual correction data of the selected wafer inspection apparatus (A); and a step of generating inspection condition data for each wafer inspection apparatus (B to C), from the common inspection condition data and the individual difference correction data of the corresponding wafer inspection apparatus (B to C).</p> |
申请公布号 |
WO2010113386(A1) |
申请公布日期 |
2010.10.07 |
申请号 |
WO2010JP01375 |
申请日期 |
2010.03.01 |
申请人 |
TORAY ENGINEERING CO., LTD.;OHMI, HIDEKAZU;YAMAMOTO, HISASHI |
发明人 |
OHMI, HIDEKAZU;YAMAMOTO, HISASHI |
分类号 |
H01L21/66;G01N21/956 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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