| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip package which has an improved shock resistance of a bonding member corresponding to corners of a semiconductor chip in a module substrate where the semiconductor chip is mounted on an insulation substrate having a circuit pattern with at least the bonding member being disposed between the insulation substrate and the semiconductor chip to fix the semiconductor chip to the insulation substrate. <P>SOLUTION: The semiconductor chip package 1 includes a circuit board 3 having a mounting surface where a circuit pattern is formed, a semiconductor chip mounted on the circuit pattern of the circuit board 3, and a bonding member 7 disposed between the circuit board 3 and the semiconductor chip and on the sides of the semiconductor chip, and for fixing the semiconductor chip to the circuit board 3. The bonding member 7 includes thermosetting resin and magnetic powder 6 dispersed in the resin, and the magnetic powder 6 locally exists in the bonding member 7 corresponding to the corners of the semiconductor chip. <P>COPYRIGHT: (C)2011,JPO&INPIT |
