发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory device which has a good-quality structure in which memory cells are arranged three-dimensionally and to provide a method for manufacturing it. SOLUTION: The method includes: a step of alternately forming a non-doped amorphous silicon layer and an amorphous silicon layer 106 containing boron on a substrate 100; a step of forming a slit by etching the amorphous silicon layer; a step of forming a sacrificial film within the slit; a step of forming a hole by etching the amorphous silicon layer; a step of forming a gap by etching the non-doped amorphous silicon layer; a step of forming an interlayer insulating film 107 within the gap and the hole; a step of forming a hole 115 by etching the interlayer insulating film 107 formed within the hole; a step of forming a block insulating film within the hole 115; a step of forming a charge storage insulating film; a step of forming a tunnel insulating film; and a step of forming a semiconductor region. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010225694(A) |
申请公布日期 |
2010.10.07 |
申请号 |
JP20090069045 |
申请日期 |
2009.03.19 |
申请人 |
TOSHIBA CORP |
发明人 |
AISO FUMIKI;ISHIDA KOICHI;FUKUMOTO ATSUSHI;NAKAO TAKASHI |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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